3.3kV SiC MOSFETs and barrier diodes have lowest RDS(on), claims Microchip

SiC MOSFETs and SiC Schottky barrier diodes enable new levels of efficiency and reliability, said Microchip. The company expanded its SiC portfolio with the release of the 3.3kV SiC devices, claimed to be the offer the industry’s lowest on-resistance [RDS(on)] and what it claimed are the highest current-rated SiC Schotty barrier diodes available. These introductions enable to take advantage of SiC technology to develop smaller, lighter and more efficient designs for electrified transportation, renewable energy, aerospace and industrial applications, said the company.

High voltage SiC offers a proven alternative to many silicon-based designs which have reached their limits in terms of efficiency improvements, system cost reduction and application innovation, Microchip contended that until now, the availability of 3.3 kV SiC power devices was limited. Its 3.3kV MOSFETs and Schottky barrier diodes join the company’s portfolio of SiC options which include 700, 1,200 and 1,700V die, discretes, modules and digital gate drivers.

The 3.3 kV SiC power devices include MOSFETs with RDS(on) of 25 mOhm and Schottky barrier diodes with current rating of 90A. Both MOSFETs and diodes are available in die or package form. 

Microchip said designers can used the devices to simplify their design, create higher-power systems and use fewer paralleled components for smaller, lighter and more efficient power systems.

Leon Gross, vice president of Microchip’s discrete product business unit, commented: “Our new family of 3.3 kV SiC power products allows customers to move to high-voltage SiC with ease, speed and confidence and benefit from the many advantages of this exciting technology over silicon-based designs.”

The 3.3 kV SiC die and discrete devices in a variety of package options are available now for order in production quantities. 

The new releases join the company’s SiC power portfolio. All Microchip devices are backed by its customer-driven obsolescence practice, which ensures devices will continue to be produced for as long as customers need them, and Microchip can produce them.

Customers can combine Microchip SiC products with the company’s other devices including 8-, 16- and 32-bit microcontrollers, power management devices, analogue sensors, touch and gesture controllers and wireless connectivity products.

The expanded SiC portfolio is supported by a range of SiC SPICE models compatible with Microchip’s MPLAB Mindi analogue simulator modules and driver board reference designs. The Intelligent Configuration Tool (ICT) enables designers to model efficient SiC gate driver settings for Microchip’s AgileSwitch family of configurable digital gate drivers. 

http://www.microchip.com

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