3D sensors inspects BGA for micrometer accuracy
Able to inspect the correct position of pins, the EyeScan AT 3D sensor, with the EyeVision image processing software, can also check for the flawlessness and position of balls on a BGA. The connectors of BGAs can be inspected with the 3D sensor for various characteristics, up to an accuracy of a micrometer, says Eye Vision Technology.
Using the laser triangulation method of the EyeScan AT, it detects faulty balls while the Scheimpflug-projection enables the laser line to stay focused and distortion-free on the surface of the component. According to the company, this means that even for a high-speed application, the captured images have a high resolution, due to the big lens and short aperture time. The lens quality is such that no lens distortion correction has to be carried out.
The EyeScan AT uses the most popular technology in 3D measurement – the laser line measurement (or laser triangulation). This means that the camera looks at a laser line, which is projected onto the component (in this case, the BGA) and calculates the height information from the laser line profile. Thanks to the 20,000 profiles/s and the new blue laser, even the most complex components and surfaces can be captured with a detailed resolution, says the company. The extremely fast scans are possible because of the shorter aperture time.
Laser class 3 and the preprocessing of the captured data with the integrated FPGA, also brings speed benefits, says the company. Additionally the high dynamic range with threefold exposure allows it to inspect bright and dark objects in the same scan, without losing speed.
Image information is sent to the EyeVision software, evaluated and further processed within the inspection program created by the customer. A drag-and-drop function ensures there are no programming skills necessary for creating an inspection program.