4U tall chassis systems supports 3U and 6U OpenVPX boards
Designed with a horizontal-loading configuration, a 4U 19-inch rackmount chassis has been developed by Pixus Technologies. The chassis has a side-to-side airflow approach and supports 3U, 6U, or a mix of 3U and 6U OpenVPX boards.
The 4U tall chassis platform supports up to six SOSA (Sensor Open Systems Architecure) -aligned or OpenVPX 6U boards along and six boards in the 3U form factor. Alternatively, the form factor can be divided into three segments that can host up to 18 boards in the 3U OpenVPX size. The chassis can accept either a fixed modular power supply or a pluggable version that is compliant to VITA 62. Rear tansition module (RTM) slots are available in certain configurations depending on the configuration of the enclosure. Backplanes are available in various sizes and configurations for multiple OpenVPX / SOSA profiles and speeds up to 100GbE. Versions with VITA 66 optical or VITA 67 RF interfaces are also available as standard.
Pixus offers 1U to 4U tall horizontal orientation 19-inch rackmount systems in side-to-side or front-to-rear cooling configurations. The enclosures can be modified to MIL rugged formats.
Leveraging over 20 years of innovative standard products, the Pixus Technologies team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on ATCA, OpenVPX, MicroTCA, and custom designs.
Pixus also has a range of VME-based and cPCI-based solutions.
In May 2011, Pixus Technologies became the sole authorised North and South American supplier of the electronic packaging products previously offered by Kaparel and Rittal.