Balanced right-angle design gives BNC connector the edge, says Samtec
Based on an exclusive right-angle design, Samtec’s 75 Ohm high density BNC is suitable for high volume pick-and-place manufacturing (-BM1D & -BM2D die-cast options).
Designed primarily for use in advanced broadcast video equipment, the Samtec HDBNC series was tested to SMPTE 2082 12G-SDI pass/fail specifications, with return loss measurements surpassing minimum requirements by a least -10dB from 0 to 12GHz. Results also show extremely low VSWR and insertion loss, reported Samtec.
The product design provides increased surface area to ensure proper vacuum sealing and the company also addressed weight modifications to ensure balance during pick-and-place operations onto the PCB. Samtec’s HDBNC-BM1D & -BM2D die-cast connectors maintain a compact design for increased panel density with 8.0mm (0.315 inch) body height and 8.5mm (0.335 inch) width. Body height matches current screw-machined right angle HDBNC Series designs, so they can be easily adapted to existing applications.
Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high speed board-to-board, high speed cables, mid-board and panel optics, precision RF, flexible stacking and micro / rugged components and cables.
Samtec technology centres are dedicated to developing and advancing technologies, strategies and products to optimise both the performance and cost of a system from the bare die to an interface 100m away and all interconnect points in between.
There are over 40 international locations and products sold in more than 125 different countries.
