Bluetooth Low Energy SoC is compact, and with sleep modes

Compact for wearable and IoT applications, the nRF52832 Wafer Level Chip Scale Package (WL-CSP) from Nordic Semiconductor occupies 25% of the footprint of the company’s standard QFN48-packaged nRF52832, with the same feature set.

It measures just 3.0 by 3.2mm (compared to the standard 6.0 by 6.0mm footprint of conventionally-packaged nRF52832 QFN48). It includes a powerful on-board 64MHz ARM Cortex-M4F processor that enables protocol and application task processing to be completed in short time-frames, says the company, to allow power-saving sleep modes to be entered more quickly compared to competing devices.

 The WL-CSP device features 512kbyte Flash and 64kbyte RAM, an on-chip NFC tag for consumer-friendly Touch-to-Pair and what is claimed to be best-in-class performance, with low power, multi-protocol Bluetooth low energy, ANT, and proprietary 2.4GHz radio. It also boasts 5.5mA peak RX/TX currents, an on-chip RF Balun, and an automatic power management system.

 The SoC is compatible with the company’s Bluetooth 4.2 stacks and supporting software development kits, including the latest S132 multi-role concurrent software stack, nRF5 SDK, nRF5 SDK for HomeKit, and nRF5 SDK for AirFuel (the resonant wireless charging technology).

 The nRF52832 WL-CSP is available now for volume production.


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