CMOS digital image sensor combines 1080p resolution with BSI pixel technology

To satisfy challenging security and surveillance applications, ON Semiconductor has introduced the AR0239 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel array of 1936H x 1188V. It claims it is the first to combine 1080p resolution with BSI pixel technology.

According to ON Semiconductor, the AR0239 produces extraordinarily clear and sharp digital images in challenging bright and low light conditions. It also has the ability to capture continuous video and single frames, making it particularly suitable for applications as diverse as security and surveillance systems, body cameras and vehicle DVRs (dash cameras).

ON Semiconductor explains that key attributes of the AR0239 include superior low-light performance, robust near infra red (NIR) quantum efficiency (QE) and the capability to capture high dynamic range scenes. The sensitive three x three-micrometer backside illuminated (BSI) pixels with improved NIR process, including ON Semiconductor’s DR-Pix technology, give a 21 per cent improvement in responsivity and a 10 per cent improvement in QE versus the device’s predecessor.

The sensor features a variety of camera functions such as in-pixel binning and windowing, and it has an on-chip analogue to digital converter (ADC) that supports both 10- and 12-bit architectures. When operating in linear mode with a serial interface, the device offers fully HiSPi/MiPi compatible HD support up to 1080p at 90-frames per second to deliver “excellent” video performance, adds ON Semiconductor. Two- or three-exposure 1080p HDR output is available at up to 30-frames per second.

The AR0239 is optimised for ease of design-in with multi-camera synchronisation capability. It is housed in an iBGA package to enhance the robustness and reliability in terms of thermal and humidity resilience and performance. The device has an operating temperature range, aligned with industrial application specifications, of -30 to +85 degree C.

The AR0239 is available in 9.0 x 9.0mm iBGA-63 packaging. Engineering samples are available now with full production planned for November 2017.


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