COM Express Basic module portfolio speeds in

Extending its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module, Congatec has equipped these modules with the high-end dual chip versions of the Intel Xeon and 7th generation Intel Core processors, codenamed “Kaby Lake”. The modules suit module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.

Application areas for these high-end COM Express Type 6 Server-on-Modules can be found everywhere where data intensive streams need to be processed and displayed in real time. Target markets include big data processing embedded clouds, edge and fog servers, medical imaging systems, video surveillance and vision-based quality control, simulation equipment, host systems for virtualised control technology, vision systems in industrial control rooms and other plant-wide supervision systems or high-end professional gaming and digital signage.

Compared with their predecessors, codenamed “Skylake”, the new modules host increased CPU frequencies and performance, more dynamic HDR graphics owing to 10-bit video codecs, and support super-fast 3D XPoint-based Intel Optane memory.

In comparison to the single chip variants of the new Gen 7 Intel Core processors, the dual chip versions set the state-of-the-art benchmark for high-end Server-on-Module applications and high-end embedded use cases with hyper threading within the embedded power envelope of up to 45 W.

The TS175 COM Express Basic module is available with two quadcore Intel Xeon processors with hyper threading as well as 5 different Intel Core i7, i5 and i3 processors within a 45 to 25 W TDP envelope. Bandwidth intensive applications will benefit from up to 32 gigabytes of fast dual channel 2400 DDR4 memory, including ECC support option.

With regards to visual experience, the modules feature the new Intel HD630 graphics supporting up to three independent displays with up to 4k at 60 Hz via DisplayPort 1.4 and HDMI 2.0, and both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules offer dual channel LVDS and VGA for legacy displays. Hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9 means HD streams are becoming more vivid and lifelike in both directions.

The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel Optane memory can be connected via PCI Express Gen 3.0 Lanes. 4x SATA 6G ports with RAID0/1 support are available for conventional storage media. Further I/O interfaces include 1x Gigabit Ethernet with Intel AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIOs, LPC, SPI, I2C Bus, and 2x UART.

The modules support the 64-bit versions of Microsoft Windows 10 and Windows 10 Internet of Things, as well as all common Linux operating systems. Individual integration support, an extensive range of accessories and optional embedded design and manufacturing services for individual carrierboard and system designs complete the package.


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