COM Express Mini module has Intel Apollo Lake processors
Designed for the industrial and extended temperature range, the credit-card sized conga-MA5 is a COM Express Type 10 COM (Computer-on-Module) and is equipped with the latest Intel Atom, Celeron and Pentium processors (Apollo Lake).
Target applications are handheld and rugged mobile applications as well as stationary mini devices and IoT gateways. Mobile devices benefit from approximately 15 per cent longer battery life while connected industrial devices benefit especially from the enhanced real-time capabilities. Graphics performance now also includes the support of 4k displays.
The credit card sized COM Express Mini modules are available with the power saving Intel Atom processors E3930, E3940 and E3950 for the extended temperature range of -40 to +85 degree C, or are fitted with the more powerful low-power dual-core Intel Celeron N3350 and quad-core Intel Pentium N4200 processors. With up to 8Gbyte dual channel DDR3L RAM, the modules offer best in class memory performance and significant bandwidth advantages compared to competing modules with only single channel memory, says the company. They also feature the Intel Gen9 graphics, which provides up to 18 execution units to support up to two independent displays via single channel LVDS/eDP and the digital display interface for DP 1.2 or HDMI 1.4b.
For IoT connectivity and generic extensions, there is a Gigabit Ethernet interface, four PCIe 2.0 lanes and eight USB ports, two of which are provided as USB 3.0. Additional peripherals can be connected via an SPI, an LPC, four GPIO and two serial UART interfaces. For the storage media, up to 128Gbyte of on board flash memory with fast eMMC 5.1, or two 6Gbit/s SATA are an option. Audio signals are carried via HDA.
Software support is provided for Microsoft Windows 10, including the Microsoft Windows 10 IoT versions and all current Linux OS. The Board Support Package will also include support for the latest Wind River IDP 3.1. Customised integration support, a range of accessories, including cooling solutions and an evaluation carrier board as well as optional embedded design and manufacturing services for application specific carrier board and system designs are also available.