congatec solders RAM for shock and vibration resistant modules
Offering resistance to shock and vibration, the conga-TC570r COM Express Type 6 computer on module (CoM) from congatec is designed with soldered RAM. The rugged module is based on the 11th Gen Intel Core processor.
Designed to withstand even extreme temperature ranges of -40 to +85 degrees C, the COM Express Type 6 CoMs provide full compliance for shock and vibration resistant operation, says congatec, making them suitable for transportation and mobility applications. For more price sensitive applications, congatec also offers a cost optimised Intel Celeron-based shock and vibration resistant variant for the extended temperature range from 0 to +60 degrees C.
The Conga-TC570r modules are based on the Tiger Lake microarchitecture will be of interest to OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and other mobile applications in challenging outdoor and off-road environments, says congatec.
Shock and vibration resistant stationary devices could also use the modules where they can be used in critical infrastructure protection (CIP) against earthquakes and other mission critical events. The Conga-TC570r modules have fast LPDDR4X RAM with up to 4266Mtransfers per second and in-band error correcting code (IBECC) for single failure tolerance and are claimed to have high data transmission quality in EMI critical environments.
There are rugged mounting options for the CoM and carrier bundle, active and passive cooling options, together with optional conformal coating for protection against corrosion due to moisture or condensation. There is also a list of recommended carrier board schematics, and for highest reliability, shock and vibration resistant components for the extended temperature range. Serviice available from congatec includes shock and vibration tests for custom system designs, temperature screening, and high speed signal compliance testing, along with design-in services, and training sessions.
The rugged COM Express Compact Type 6 11th Gen Intel Core (code name Tiger Lake) modules are available based on Intel Core i7-1185GRE, Intel Core i5-1145GRE, Intel Core i3-1115GRE or Intel Celeron 6305E. The modules offer significantly greater CPU performance and nearly 3x higher GPU performance compared to their predecessors and include PCIe Gen4 support. For graphics and compute workloads, there are up to four cores, eight threads and up to 96 graphics execution units for parallel processing. The integrated graphics supports 8k displays or 4x 4k.
It can also be used as parallel processing unit for convolutional neural networks (CNN) or as an artificial intelligence (AI) and deep learning accelerator. The CPU integrated Intel AVX-512 instruction unit with support vector neural network instructions (VNNI) to accelerate AI applications. The Intel OpenVINO software toolkit includes optimised calls for OpenCV, OpenCL kernels, and other industry tools and libraries to extend workloads across CPU, GPU and FPGA compute units to accelerate AI workloads, including computer vision, audio, speech, and language recognition systems.
The thermal design power (TDP) is scalable from 12 to 28W, enabling fully sealed system designs with passive cooling only. The conga-Conga-TC570r COM Express Type 6 module design includes support for time sensitive networking (TSN), time co-ordinated computing (TCC) and RTS Realtime Systems’ hypervisor for virtual machine deployments and workload consolidation in edge computing.
