Consumer BGA processors take to high-quality embedded boards
The 8th generation Intel Core Mobile processors (codenamed Whiskey Lake) launched by Congatech consist of COM Express Type 6 Compact modules, 3.5in SBCs and Thin Mini-ITX motherboards – all equipped with consumer-grade Intel Core i7-8565U mobile processors.
The hybrid embedded conga-JC370 3.5 inch SBCs, conga-IC370 Thin Mini-ITX motherboards and conga-TC370 COM Express Type 6 modules come with the 1.8 GHz quad-core Intel Core i7-8565U Mobile processor that offers a performance increase of up to 40 per cent compared with previous U-Series processors, says Congatech. This is attributed to a rise from two to four cores, along with the improved microarchitecture.
The memory is designed to match this performance boost: Two DDR4 SODIMM sockets with up to 2400 MT/s are available for a total of up to 64GB
USB 3.1 Gen2 is now supported natively. This USB SuperSpeed+ interface is can transfer up to 10Gbps, which makes it possible to transfer uncompressed UHD video from a camera to a monitor.
The 3.5in SBC provides this performance via a USB-C connector that also supports 1x DisplayPort++ and power supply for peripheral devices, thereby enabling monitor connection with a single cable for video, touch and power.
The COM Express modules support the same feature set on carrier boards. Further interfaces depend on the form factor but all support a total of 3 independent 60Hz UHD displays with up to 4096×2304 pixels as well as up to 2x Gigabit Ethernet (1x with TSN support).
The new boards and modules also offer 15W TDP, which is scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in turbo boost mode).
Targeted at harsh and space-constrained environments, OEM customers get early access to the new high-end processor technology and can benefit from first-to-market strategies.
Industrial end-customers can profit from an instant application performance boost of up to 40 per cent compared with previous U-Series processors – enabled by four instead of two cores, plus an overall improved microarchitecture.