Cool it for mil-spec, rugged rackmount SOSA chassis
A 6U 19-inch rackmount chassis for 3U OpenVPX and SOSA-aligned boards has been released by Pixus Technologies. The chassis was designed specifically for the high-power requirements of solutions that are aligned to the SOSA technical standard, explained the company.
The rugged rackmount chassis supports up to 16 conduction-cooled modules per SOSA requirements and VITA 48.2 specifications. A specialised card mat set diverts heat to fins which spread the heat away from the card cage. Rear mil-grade fanspull airflow through the fins to cool in excess of 100W per slot, depending on the specific requirements of the application.
Pixus provides a wide range of OpenVPX and SOSA-aligned profiles up to 100GbE and PCIe Gen4 speeds. Various implementations of VITA 62 power supply configurations are available along with customisable I/O solutions for VITA 66 / VITA 67 or other interfaces. Pixus also offers a mezzanine-type of VPX chassis manager designed for SOSA-aligned applications. The unit is VITA 46.11-compliant and resides behind the backplane (without blocking any VITA 66/67 interfaces). It does not take up any plug-in slots, added Pixus.
Pixus offers OpenVPX chassis solutions in various grades from commercial to mil-rugged. The collection consists of 3U and 6U-sized boards.
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on SOSA-aligned, OpenVPX, ATCA, MicroTCA, and custom designs.
Pixus also has an extensive offering of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the sole authorised North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.
