CSP LED components are for automotive lighting

LED package with CSP (chip scale packaging) is available in the Fx-CSP range from Samsung Electronics. The LED packages combine CSP and flexible circuit board technology, which enable more compact chip sizing and a higher degree of reliability, says the company.

The use of a flexible circuit board also enables more heat to dissipate, which leads to lower resistance and brings about a greater degree of lumen/W efficiency than using a ceramic board.

The automotive LED line-up allows car designers to use a variety of chip arrangements such as a single chip, a one by four, or a two by six multi-chip arrangement. They can be used in vehicles’ position lamps and daytime running lamps as well as headlamps that require higher luminous flux and reliability than other automotive lamps.

The Fx-CSP line-up consists of single packages, Fx1M and Fx1L, with 1.0 to 3W each, as well as packages with a 14W high voltage array, Fx4 and a 40W high voltage array, Fx2x6. The wattage level options allow the packages to be used with a range of exterior automotive lighting.

http://www.samsung.com/semiconductor

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