DSP is designed for compute-intensive signal processing
Designed for compute-intensive SoC designs in automotive, consumer, IoT and industrial applications, the Tensilica Fusion G3 DSP is the latest multi-purpose DSP from Cadence Design Systems.
It shares the same Xtensa instruction set architecture with the earlier Fusion F1 DSP, but with richer and higher throughput DSP instructions that the general-purpose DSP. It has quad 32-bit integer MACs and quad single-precision 32-bit floating-point MACs, and is suitable applications are compute-intensive applications including radar, imaging and mid- to high-end audio pre- or post-processing.
In evolving markets, such as automotive or IoT, DSP requirements change, so a multi-purpose DSP IP can support a wider range of data types and operations, both fixed and floating point. “A single, extensive, DSP ISA that handles many different compute-intensive signal processing tasks, can future-proof SoC designs in fast changing markets,” says Mike Demler, senior analyst of The Linley Group.
The DSP was co-designed with a lead customer and has already been taped out in silicon. It will be available for broad licensing in October 2016.
