FDMF8811 100V bridge power stage module saves space and component count

ON Semiconductor has introduced the FDMF8811 100V bridge power stage module at APEC 2017. The FDMD8811 is designed for half-bridge and full-bridge DC/DC converters and is claimed to ‘significantly’ reduce board space requirements and component count, while maintaining high system efficiency and reliability for the cloud infrastructure.

The 25A-rated FDMF8811 integrates a 120V driver IC, a bootstrap diode, and two MOSFETs in a PQFN-36 package.

The FDMF8811 reduces the board area required for DC/DC converter designs by approximately one third compared to discrete implementations, says the company. If space is not a concern, the FDMF8811 also enables increased power delivery within the existing available board area, says ON Semiconductor. The FDMF8811 is particularly useful in cloud applications such as wireless basestations, power modules or any on-board, isolated DC/DC converter, and industrial applications such as motor drives, fans and heating, ventilation, air-conditioning (HVAC).

According to ON Semiconductor, the integration of key power components allows the company to optimise the design with regards to driver and MOSFET dynamic performance, system parasitic inductance and power MOSFET RDS(ON), to maintain efficiency. The FDMF8811 delivers system efficiencies in excess of 97 per cent in full-bridge 600W applications.

 The FDMF8811 opens a new product category by enabling higher levels of power density in isolated DC/DC converters in the cloud infrastructure, says ON Semiconductor.

 ON Semiconductor believes it can address the entire ecosystem around the cloud, from smartphones to personal computers (PCs) to datacentre infrastructure.

The FDMF8811 is available now in clip bond PQFN-36 packaging.

Visit ON Semiconductor at APEC 2017 (March 26 to 30, Tampa Florida, USA) at booth 1001.

ON Semiconductor supplies semiconductors to reduce energy use, with a portfolio of  energy-efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, system of chips (SoCs) and custom devices for automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.



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