Flash memories enable instant-on IoT applications
Instant-on capability in automotive, industrial and IoT applications is enabled using the HyperFlash and HyperRAM memories in a multi-chip package (MCP).
The MCP measures just 8.0 x 6.0mm and contains the 3V 512Mbit HyperFlash and 64Mbit HyperRAM.
The MCP combines a high-speed NOR flash memory for fast-boot, instant-on capability with a self-refresh DRAM for expanded scratchpad memory in a low-pin-count package for space-constrained embedded designs, such as automotive clusters and infotainment systems, communication equipment, industrial systems and consumer products.
The HyperFlash and HyperRAM MCP leverages the company’s 12pin HyperBus interface and is housed in a 24-ball BGA package that shares a common footprint with both discrete HyperFlash and HyperRAM products. This common footprint enables design engineers to implement a single-pad layout that supports either discrete device or the MCP, allowing changes at any point in the design without affecting board layout.
Customers and partners developing FPGA, ASIC or ASSPs are supported by the HyperBus Master interface controller IP package. Customers can integrate this IP into the host controller platform to accelerate product design cycles. The controller IP supports both HyperFlash and HyperRAM products and is free of charge and royalty-free.
The HyperFlash and HyperRAM MCP is offered in the industrial (-40 to +85 degree C) and industrial-plus (-40 to +105 degree C) temperature ranges. Both temperature ranges are also available with AEC-Q100 automotive qualification and with production part approval process (PPAP) support.
The Cypress 3V, 512Mb HyperFlash and 64Mb HyperRAM MCP is qualified now with production beginning in Q4 2016. 1.8V HyperFlash and HyperRAM MCP products will be available Q1 2017.