Gap filler pads relieve the stress
For applications that have delicate components or widely varying gap distances, Fujipoly has created a line of low compression force gap filler pads. These thermal insulation materials help avoid overstressing the PCB and fragile solder joints as the interface material is compressed between the heatsink and board-level components during assembly.
The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase, advises Fujipoly. To accommodate broad-ranging applications, Fujipoly offers several low compression force Sarcon materials that exhibit compression forces less than 15PSI, depending on thickness. Thickness options range from 1.0 to 5.0mm with thermal conductivity between 1.5 and 2.8 W/m•K.
Fujipoly’s technical support is available to help determine the best material for an application. The staff can quickly analyse the relationship between gap size, material thickness, compression and contact resistance. All Low Compression Force thermal interface materials can also be custom cut to precisely fit the shape a project needs.
Fujipoly America is a wholly owned subsidiary of Fuji Polymer Industries of Japan. An ISO9001:2015 registered company, Fujipoly America specialises in the fabrication of silicone rubber technology. It provides Zebra elastomeric connectors, Sarcon thermal interface materials, fusible tapes, and custom silicone rubber extrusions.
Fuji Polymer Industries has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company’s North American operations are based in Carteret, New Jersey.
