Infineon introduces Source Down packaging for “modern power management”
The first tranche of products available in the Source Down industry standard package is the OptiMOS 25V power MOSFET.
The company launched the MOSFET in the PQFN package which measures 3.3 x 3.3mm. According to Infineon, it sets an industry benchmark in MOSFET performance, reducing on-state resistance and offering superior thermal management capability. It is intended for use in a range of applications, including switch mode power supplies (including server, telecomms and OR-ing supplies), battery management and drives.
The package connects the source potential (instead of the drain potential) to the thermal pad. This design offers new PCB layout possibilities and helps achieve higher power density and performance, explains Infineon.
There are two footprint versions: the source-down standard-gate and the source-down centre-gate, both in a PQFN 3.3 x 3.3mm package. The source-down standard-gate footprint is based on the current PQFN 3.3 x 3.3mm pinout configuration. The location of the electrical connection remains the same, which simplifies the drop-in replacement of standard drain-down packages with the new source-down package. For the centre-gate version, the gate pin is moved to the centre to facilitate the parallel configuration of multiple MOSFETs. The larger drain-to-source creepage distance makes it possible to connect the gates of multiple devices on a single PCB layer. Infineon adds that moving the gate connection to the centre leads to a wider source area for improved electrical connection of devices.
This technology innovation results in major reduction of RDS(on) by up to 30 per cent compared to current technology. The thermal resistance between junction to case (R thJC) is also “significantly improved compared to the current PQFN packages”. Other charactersistics reported are reduced parasitics, improved PCB losses and superior thermal performance.
Both OptiMOS Source-Down 25V power MOSFETs in a PQFN 3.3 x 3.3 mm package are now available.
