Infineon introduces source-down power MOSFETs in PQFN package
Infineon now offers its OptiMOS power MOSFETs in a PQFN package and with source-down technology. The PQFN packages measure 3.3 x 3.3mm2 and are available in a wide voltage class ranging from 25 to 100V.
According to Infineon, this package sets a new standard in power MOSFET performance, offering higher efficiency, higher power density, superior thermal management and low bill of materials (BoM). The PQFN is suitable for a variety of applications including motor drives, switch mode power supplies (SMPS) for servers and telecomms and OR-ing, as well as battery management systems.
The latest source-down package technology enables a larger silicon die than the standard drain-down concept, yet the package outline is the same. Losses contributed by the package, limiting the overall performance of the device, can also be reduced for a reduction in RDS(on) by up to 30 per cent compared to the most advanced drain-down package, says Infineon.
At system level, the form factor can be reduced, allowing the possibility to move from a SuperSO8 with a footprint of 5.0 x 6.0mm2 to the 3.3 x 3.3mm2 package – representing a space reduction of about 65 per cent. The space that has been freed up can be used to enhance power density and system efficiency.
Source-down technology means the heat is dissipated directly into the PCB through a thermal pad instead of over the bond wire or the copper clip. This improves the thermal resistance (RthJC) by more than 20 per cent, from 1.8k/W down to 1.4k/W to simplify thermal management.
Infineon offers two footprint versions and layout options, namely the SD Standard-Gate and the SD Center-Gate. The Standard-Gate layout simplifies the drop-in replacement of drain-down packages, while the Center-Gate layout enables optimised and easier parallelisation. The two options can optimise the arrangement of devices on a PCB for space and parasitics considerations, notes Infineon.
OptiMOS source-down power MOSFETs are now available in PQFN 3.3 x 3.3mm2 packaging, voltage classes from 25 to 100V and two footprint versions.
