Integrated module addresses automotive BLDC systems
Optimised for driving three-phase brushless DC (BLDC) motors, the STK984-190-E power integrated module has been announced by ON Semiconductor.
The module contains six 40V, 30A MOSFETs configured as a three-phase bridge with an additional 40V, 30A high-side reverse battery protection MOSFET. The MOSFETs are mounted onto a direct bonded copper substrate, resulting, says the company, in a compact module taking up only half of the board space used by an equivalent, discrete design.
The module is suitable for use in 12V automotive electric motor drive applications with power ratings up to 300W, such as electric pumps, fans and windscreen wipers.
Using the module reduces both the component count and the bill of materials. The substrate reduces the thermal resistance, which reduces the operating temperature of the MOSFETs. This reduces power losses and increases reliability due to a reduced change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the substrate. Operational temperature range is -40 to 150°C. The integrated MOSFETs are AEC-Q101 qualified.
The module is supplied in a Pb-free DIP-S3, measuring 29.6 x 18.2 x 4.3mm.