IP enables secure communications between chiplets
Secure die-to-die communication between chiplets can be achieved with the Fortrix SecureD2D IP, says CEVA. The IP enables secure authentication and firmware boot / code load between chiplets in a heterogeneous SoC (HSoC).
The cost of developing monolithic SoCs at advanced nodes has increased, and coupled with long design cycles and manufacturing lead times, this has led to the emergence of chiplets as a viable, cost-effective alternative, explains CEVA.
Security and assurance are key considerations for the adoption of HSoCs as the chiplet dies can originate from different vendors and different global supply chains. This is a key consideration for the deployment of chiplets in the aerospace and defence, industrial and automotive markets as well as in any IoT-related application where HSoCs are targeted.
CEVA, through its wholly-owned subsidiary, Intrinsix, offers the Fortrix SecureD2D IP to enable secured communication between chiplets in an HSoC.
The Fortrix SecureD2D IP consists of a controller communicating over a secure fabric to hardware-based crypto accelerators which perform rapid encryption and decryption to enable cryptographic functions such as ECDSA, SHA2 and AES. A low-level firmware API and a customisable high-level application allow rapid integration into secure chiplets and the IP implements both leader and follower termination points.
Fortrix SecureD2D IP is available for licensing today. Deliveries include RTL, SDC constraints, firmware and documentation. The IP is suitable for any semiconductor process, confirmed CEVA. The company also provides design services to help integrate and support the security IP and chiplet development in addition to full HSoC design and delivery.
The IP was selected and deployed as part of the Department of Defense State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program and has already been adopted by Lockheed Martin and a world-leading semiconductor company, reported CEVA.
CEVA is a licensor of wireless connectivity and smart sensing technologies and integrated IP. It provides DSPs, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and AI. These technologies are offered in combination with our Intrinsix IP integration services, to help customers address complex and time-critical IC design projects.
The company’s DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low-power, always-on / sensing applications for multiple IoT markets. For sensor fusion, its Hillcrest Labs sensor processing technologies provide a range of sensor fusion software and inertial measurement units (IMUs) for markets including hearables, wearables, AR / VR, PCs, robotics, remote controls and the IoT. For wireless IoT, it supplies platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6/6E (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS.
