Jetting solder paste and conditioner are for no-clean, halogen-free systems
Indium has developed the PicoShot NC-5M jetting solder paste for customers needing a no-clean halogen-free SAC305 solder paste for Mycronic jetting systems or add-on and repair modules.
PicoShot NC-5M jetting solder paste is the first material to come out of Indium’s partnership with Mycronic, which produces dispensing and jet printing equipment.
PicoShot NC-5M is a no-clean halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic’s MY 600/700 jetting systems. PicoShot can be used in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield attach, and microBGA. It also complements the stencil printing of Indium8.9HF. Designed as a no-clean solder paste, PicoShot can be cleaned with industry standard cleaning solutions.
The PicoShot NC-5M’s formulation meets or exceeds ANSI/IPC J-STD-004B ROL0 requirements, halogen-free requirements per IPC and IEC61249-2-21 standards
IPC standards for SIR and ECM
Indium also reports that it provides jetting performance for a halogen-free Pb-free solder paste and reflows in air or nitrogen (ppm O2 level from 50 to 1,000). It has a clear residue with minimal flow-out and reduces or eliminates altogether, graping and minimises reflow spatter.
Indium also offers a PicoShot NC-5M conditioner (purging gel) designed to allow the rapid purging, cleaning, and long-term storage of jetting, dispense, and microdispense systems without the use of liquid solvents. PicoShot Conditioner C-1 (pictured) is a chemically benign, bright blue-coloured translucent, viscous gel that aids in visual endpoint detection and prevents inconsistent dispense volumes and clogging caused by solder paste dry-out.
Materials manufacturer and supplier, Indium, has customers in the global electronics, semiconductor, thin-film and thermal management markets. Products include solders and fluxes, brazes, thermal interface materials, sputtering targets, indium, gallium, germanium and tin metals and inorganic compounds and NanoFoil.
The company was founded in 1934, and has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the UK and the USA.
