Low profile connector can be used in medical devices

Reducing board stack height by 15 per cent, the latest addition to the Mezza-pede SMT connectors has been announced by Advanced Interconnections.

The DHAL model design features a thin insulator, which at only 0.025inch (0.63mm) is half the thickness of the original header design. When paired with mating socket model DHS, a z-axis stack height of 0.132inches (3.4mm) is achievable. The connector can achieve a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to hand-held medical electronic devices.

The Mezza-pede SMT connectors can be used for 1.0mm pitch board-to-board and cable-to-board interconnections in high density electronic designs, where space is at a premium. The DHAL model is currently available with 14 positions and features the company’s proprietary SMT lead frame and pin design. This is claimed to combine high reliability screw-machined terminals with an over-molded lead frame in a precision-moulded LCP insulator.

Mezza-pede SMT connectors with 30micro inches gold plating pass the 20-day mixed flowing gas (MFG) test, required by the most demanding telecommunications applications. All connectors in the series are RoHS-compliant, usable at operating temperatures from -55 to +125°C, and can handle up to 1.1A current at +80 degree C.



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