Monolithic 100G optical I/O cores serve GF Fotonix-based data centres
GF Fotonix is Global Foundry’s monolithic platform which combines its differentiated 300mm photonics and RF-CMOS features on a silicon wafer. At OFC 2022, photonics interconnect company, Ranovus announced availability of the protocol-agnostic Odin 100G optical I/O cores based on GF Fotonix.
Odin 100G optical I/O chiplets and IP cores can be integrated with processors, switches and memory appliances to enable new data centre architectures for machine learning (ML), artificial intelligence (AI), metaverse, cloud, 5G communications and defence and aerospace.
Data centres are increasingly demanding efficient and cost-effective high-capacity interconnects to meet the exponential growth in data-driven applications like ML/AI and metaverse. Odin 100Gbits per second optical I/O scales from 8- to 32-cores in the same footprint by combining Ranovus’ 100Gbits per second per wavelength monolithic EPIC (electro-photonic IC) cores with its proprietary laser and advanced packaging technologies.
“We are delighted to share our multi-disciplinary silicon-photonics IP cores and chiplets, and advanced packaging solutions with our customers who are driving the adoption of novel data centre architectures based on integrating best-in-class chiplets and co-packaged optics”, said Hojjat Salemi, chief business development officer of Ranovus. “Our close collaboration with GlobalFoundries underlines our joint commitment to deliver a fully featured set of qualified IP cores and chiplets with OSAT [outsourced semiconductor assembly and test] -ready, high volume manufacturing flows and supporting ecosystem to enable the huge potential of monolithic silicon photonics,” he added.
Ranovus has developed a flexible co-packaged optics architecture (Analog-Drive CPO 2.0) together with a Tier 1 ecosystem for high volume manufacturing of Odin chiplets.
“ Ranovus’ IP cores, chiplets and advanced packaging solutions, combined with GF Fotonix, provide customers a complete solution to develop the chips needed solve some of the biggest challenges facing data centres today,” commented Anthony Yu, vice president, Computing and Wired Infrastructure Strategic Business Unit at GF.
Ranovus has operations in Ottawa, Canada, Nuremberg, Germany and Sunnyvale, USA. It develops and manufactures advanced photonics interconnects to support the next generation of AI/ML workloads in data centres and communication networks. The team has experience in product development and commercialisation of optoelectronics subsystems for the information technology industry. Ranovus’ portfolio of IP cores includes multi-wavelength quantum dot laser technology and advanced digital and silicon photonics IC technologies.
Its Odin platform is the enabling technology for a new data centre architecture optimised for AI/ML, metaverse, cloud and 5G communications workloads.
