Mouser adds ON Semiconductor’s module for driving BLDC motors
Optimised for driving three-phase brushless DC (BLDC) motors in automotive applications, the STK984-190-E power integrated module (PIM) is now available from Mouser Electronics. The seven MOSFETs are mounted onto a direct bonded copper (DBC) substrate, claimed to result in a compact module, good thermal performance and taking up only half of the board space used by an equivalent discrete solution.
The STK984-190-E PIM contains six AEC-Q101 qualified 40V, 30A MOSFETs configured as a three-phase bridge with an additional 40V, 30A high-side reverse battery protection MOSFET. The module’s DBC substrate reduces thermal resistance, which lowers the operating temperature of the MOSFETs and decreases power losses while increasing reliability with a limited change in temperature during thermal cycling. Reliability is also improved by the isolation provided by the DBC substrate, claims the company.
The module is supported by the STK984-190-EGEVB evaluation board, and is suitable for use in 12V automotive electric motor drive applications with power ratings up to 300W, such as electric pumps, fans, and windscreen wipers.