Multi-channel USB interface ICs support Hi speed devices
Dual- and quad-channel USB-to-UART/MPSSE bridge ICs have been announced by FTDI, with built-in Type-C/PD controllers. The multi-channel USB interface ICs are designed for next-generation power requirements for use with larger items of hardware which are starting to use the protocol.
Available in both two-channel (FT2233HP) and four-channel (FT4233HP) versions, the high-speed (480Mbits per second) devices have serial UART (RS232, RS422 or RS485) and MPSSE (JTAG, I2C, SPI or Bit-Bang) interfacing capabilities. They are also fully compliant with Rev 3.0 of the USB power delivery (PD) specification. Each features a Type-C/PD controller for negotiation and power gauging, before deciding on the appropriate course of action and offloading work that the system microcontroller would perform). Equipment that integrates these IC can either draw or provide power according to needs, with power levels of up to 100W supported.
The PD policy engine is based on a 32-bit RISC processor core, with 8kbyte of data RAM and 48kbyte of code ROM embedded and manages the respective PD ports. The PD1 port can act as either a power sink or power source; the PD2 port only acts as a power sink. All USB protocol handling can be accomplished directly on chip, so there is no need for USB specific firmware programming which significantly streamlines the whole implementation process, says FTDI. Access to the company’s royalty-free USB drivers (for Windows, Linux, Mac and Android) means that engineers do not need to create their own drivers from scratch.
The FT2233HP and FT4233HP ICs are available in 76-pin QFN packages and 80-pin LQFP packages. An extended operational temperature range of -40 to +85 degrees C allows the ICs to be deployed in harsh industrial environments. The ICs are suitable for use in domestic appliances, test instrumentation, factory automation systems, power tools, lighting equipment, barcode readers and consumer electronics products.
FTDI Chip is a fabless semiconductor company which has an objective to ‘bridge technologies’ in order to support engineers with feature-rich, robust and simple-to-use product platforms to create electronic designs with low peripheral component requirements, low power budgets and minimal board real estate. FTDI Chip’s USB product line includes R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 brands.
FTDI Chip’s headquarters are located in Glasgow, UK and supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) and regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).
