Multiple modules are for tin-lead soldering in avionics and defence

Over 53 uModule (micromodule) products with SnPb BGA packages, target applications where the use of tin-lead soldering is preferred, such as in defense, avionics and heavy equipment industries. A uModule, PoL regulator with SnPb BGA package simplifies PCB assembly, says Linear Technology, as they provide surface mount PCB assembly, complete, encapsulated DC/DC regulator circuit in one BGA and  100% tested PoL regulators rather than circuit PoL regulators that need verification.

The company also says that cleaning under the BGA package is simpler, due to the higher standoff compared to flat LGA or QFN packages.

The reflow temperature is identical to the other tin-lead components on the PCB, says the company, whereas a higher temperature is required for PoL regulators with Pb-free solder paste.

The modules with SnPb BGA packages are offered in four DC/DC converter categories: step-down or buck converters with single and multiple outputs, buck-boost converters, isolated converters, and converters with PMBus digital telemetry with read and write data capability.

http://lt.linear.com/00w

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