Nexperia provides electrothermal models for MOSFETs
Electrothermal models covering the entire operating temperature range of Nexperia’s MOSFETs also enable EMC performance to be investigated even before prototyping.
Nexperia has introduced the enhanced electrothermal models for its MOSFET devices. Unlike typical simulation models released by semiconductor manufactuers for their MOSFETs, instead of a limited number of device parameters which have been modelled at typical operating temperatures, these models capture the thermal interdependency of the complete set of device parameters across the full operating temperature range from -55 to +175 degrees C.
Reverse diode recovery time and device EMC performance are included to further increase accuracy, said Nexperia. Engineers can create accurate circuit and system level simulations and assess the electrical, thermal and EMC performance before committing to build a prototype. The models also help save time and resources because engineers, who were previously required to ensure that their designs could operate under (unlikely) worst-case conditions, can now simulate their designs across specific temperatures ranges, claimed Nexperia.
The models were developed in partnership with a Tier 1 OEM and are designed to give designers “the ultimate degree of confidence in the results of their circuit simulations,” said Andy Berry, applications engineer with Nexperia.
The advanced electrothermal models are the latest in a series of next generation support tools, designed by engineers for engineers, planned for release by Nexperia to support external activity in making device design-in as seamless as possible for customers.
Nexperia specialises in the high-volume production of essential semiconductors, components that are required by every electronic design in the world. The company’s portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analogue and logic ICs.
Headquartered in Nijmegen, the Netherlands, Nexperia annually ships more than 100 billion products, meeting the stringent standards set by the automotive industry in small packages that save valuable energy and space.
The company has employees across Asia, Europe and the US. It is a subsidiary of Wingtech Technology, has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and ISO 45001.
