OLED micro display is small and light for VR/AR

OLED micro displays from Sony Semiconductor Solutions are suitable for use in small video displays. The displays are very thin, exhibit high brightness, operate at low power and are made from a solid Si-wafer substrate.

The ECX335B OLED micro display from Framos is used by Sony in a small, high resolution product that it says is especially well-suited for head-mounted devices enabling virtual reality and augmented reality that is light in weight and with fast response speeds.

The ECX335B is a small 0.71 inch (18mm) diagonal active matrix colour OLED panel module based on single crystal silicon substrate. It provides a full-HD RGB resolution of 1920 x 1080 dots. The panel provides a small and flexible lightweight display, confirms Framos. Sony Semiconductor Solutions’ expertise in both OLED and semiconductor technology, has resulted in the display having a wider colour gamut with a contrast ratio of 100,000:1 and an extremely short response time of micro seconds. With 24-bit colour depth, high resolution, maximum luminance is up to 500cd/m² while a serial mini-LVDS or LVDS interface units can easily be integrated into OEM devices, adds the company.

The ECX335B display is suitable for many potential applications using micro-sized displays in both industrial and consumer electronics. It is especially recommended as an electronic view finder in broadcasting and consumer cameras or for greater visual impact in 3D head-mounted devices for augmented and virtual reality. The ECX335B display provides natural colour reproduction and superior moving picture quality. High-precision binoculars and monocular devices benefit in addition.”

The high contrast provided by the ECX335B OLED Microdisplay allows the additional information layer to appear seamlessly, simply added to the background for a “real AR” experience, says Framos. OLED Microdisplay, with no colour breakup, produces very high visibility of the additional layer with crisp, clear images, without blurring. The small package footprint allows wearables to be produced in a more compact form at reduced weight, increasing usability and wearing convenience.



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