Orbotech integrates four optical inspections in Ultra Dimension series
Orbotech has introduced the Ultra Dimension automated optical inspection (AOI) series for PCB production. It reduces the total cost of ownership of PCB AOI by integrating leading pattern inspection, laser via inspection, Remote Multi-Image Verification (RMIV) and 2D metrology into a single AOI solution, claims Orbotech.
Designed to meet the rigorous demands of advanced PCB manufacturing processes, the Ultra Dimension is believed to be the first AOI solution to integrate four leading solutions – pattern inspection, laser via inspection, RMIV and 2D metrology – into a single system. Manufacturers can increase quality and yield as well as dramatically reduce their overall total cost of ownership, say Orbotech.
Unveiled at this week’s TPCA, Taipei Nangang Exhibition Center, Taiwan (25 -27 October 2017), at Orbotech’s stand (booth J1126), the Ultra Dimension’s combination of high precision and high quality pattern inspection and laser via (LV) inspection is powered by Orbotech’s proprietary Triple Vision Technology and Magic Technology. By using varied light settings and three different types of images, these technologies enable Ultra Dimension to improve detection capabilities significantly, reduce false alarms and decrease inspection set-up time. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks which can cause defects to be overlooked.
Orbotech’s 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP as well as advanced HDI applications.
Orbotech’s RMIV enables the remote verification of multiple image defects, which are automatically and simultaneously acquired during the inspection process. Orbotech’s multi-image technology enables operators to accurately differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up floor space in the AOI room and allowing manufacturers to cut their overall labor and operational costs significantly, adds Orbotech.