PD can be raised via USB ports, one channel at a time
Single-channel interface ICs, the FT23xHP series have been added to FTdi Chip’s portfolio of devices that support USB power deliver (PD),
The compact, streamlined interface ICs are supplied in QFN packages. They support operation across just one channel, thereby enabling systems that are subject to space or budgetary constraints to still benefit from elevated levels of PD via their USB ports, says FTDI Chip. Data can still be transferred at 480Mbits per second without any interruption should the direction of power flow change (with the system shifting from a source into a sink, or vice-versa).
Each FT23xHP has an integrated Type-C/PD controller element. This is designed to undertake all the negotiating and power level detection activities prior to the supply being initiated. As a result, no intervention is required from the system microcontroller. In line with revision 3.0 of the USB power delivery specification, up to 100W can be transferred. There are different I/O options included within the IC, such as RS232, RS422, RS485, JTAG, I2C and SPI.
The FT23xHP joins the dual-channel FT223xHP and the quad-channel FT423xHP ICs. The three options offer engineers the choices to specify a USB PD device that best fits the operational parameters of a specific application in terms of board real estate, pin count, bill-of-materials cost.
All three USB power delivery devices supplied by FTDI Chip are able to operates across a wide temperature range of -40 to +85 degrees C. Target applications are household appliances, barcode scanners, test equipment, industrial automation hardware, computer peripherals, power tools and lighting systems.
FTDI Chip develops innovative silicon devices which ‘bridge technologies’ in order to support engineers with sophisticated, feature-rich, robust and simple-to-use products to create electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
FTDI Chip’s long-established, USB product line boasts universally recognised product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series.
FTDI Chip is a fabless semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei as well as regional sales and technical support sites in Glasgow, Taipei, Tigard (in Oregon, USA) and Shanghai.
