Peltier modules from CUI use arcTEC structure for thermal operation
CUI’s Thermal Management Group has announced Peltier modules based on its arcTEC, which boasts superior performance and reliability, says CUI.
The construction uses a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from silicon ingot. The elasticity of arcTEC’s resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, which reduces stress on the elements, for a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time, claims CUI. High temperature solder and larger silicon elements are incorporated to enable faster and more uniform cooling.
The CP20H, CP30H, CP39H, CP60H, and CP85H Peltier modules all employ the arcTEC structure and range in size from 15 to 40mm, with profiles as low as 3.1mm. These thermoelectric modules are available with a Tmax of 77 degree C (Th=50 degree C) and current ratings ranging from 2.0 to 8.5A.
The solid state construction, precise temperature control, and quiet operation, mean that the thermoelectric coolers are suited to high density, high power medical and industrial applications as well as refrigeration and sealed environments, where forced air cooling is not an option.
The CP20H, CP30H, CP39H, CP60H, and CP85H series are available immediately from CUI.
CUI is an electronic components manufacturer specialising in power electronics, with interconnect, audio, motion and thermal management groups.
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