PFC modules for industrial motor drives debut at APEC 2021
ON Semiconductor has announced integrated converter-inverter power factor correction (PFC) modules for industrial motor drives, servo drives and heating, ventilation and air conditioning (HVAC) systems at this year’s virtual APEC exhibition and conference.
The NXH50M65L4C2SG and NXH50M65L4C2ESG transfer−moulded power integrated modules (TMPIM) are based on a standard aluminium oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. The rugged modules simplify compact motor drive design, says ON Semiconductor.
The motor drives are for rugged industrial applications with high output power. They contain a converter-inverter-PFC circuit comprised of a single phase converter with four 75A, 1600V rectifiers. The three-phase inverter uses six 50A, 600V IGBTs with inverse diodes while the dual-channel interleaved PFC has two 75A, 650V PFC IGBTs with inverse diodes and two 50A, 650V PFC diodes. There is an embedded NTC thermistor for temperature monitoring during operation.
The pre-assembled module has an optimised layout and configuration, with small parasitic elements compared with discrete PCB-based designs. According to ON Semiconductor, this allows a wide PFC switching frequency range between 18 and 65kHz.
The NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50A permitting use in applications up to 8kW. They join other devices in the TMPIM family, which have current ratings of 20 and 30A.
The compact transfer-moulded DIP-26 package measures just 73 x 47 x 8.0mm. This is a 20 per cent area savings over current solutions, claims ON Semiconductor, and enables higher levels of power density. The sealed and robust package includes an integrated heatsink (with 6.0mm clearance to pins) and offers high levels of corrosion resistance.
A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.
APEC runs from 14 to 17 June.
ON Semiconductor supplies power, analogue, sensor and connectivity solutions for engineers to solve design challenges in automotive, industrial, cloud power, and IoT applications.
The company is headquartered in Phoenix, Arizona, with a global network of manufacturing facilities, sales and marketing offices and engineering centres in its key markets.
