Planar X series RF filters are surface mount design
Board-level, ceramic-based, thick film RF filters in the Planar X series from Smiths Interconnect are available in bandpass, bandstop, lowpass and highpass configurations up to 18GHz (Ku band).
The filters have a small footprint, are light in weight and surface mountable to allow for high-volume pick and place applications for satellite comms, radar and broadcasting industries.
“Planar X Series complements our broad portfolio of RF and Microwave components with the latest technology in RF filters, offering premium performance in a small package,” says Paul Harris, sales and marketing vice president at Smiths Interconnect.
The Planar X Series uses existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution for compact size and lightweight, resulting in reduced system mass in critical space applications. The rejection characteristics are claimed to provide best in-class RF performance and the robust materials used make them suitable for harsh environments.
Smiths Interconnect provides technically-differentiated electronic components, subsystems, microwave and radio frequency products for critical applications in the commercial aviation, defence, space, medical, rail, semiconductor test, wireless telecommunications and industrial market segments.
Smiths Interconnect is part of Smiths Group, a global technology group delivering products and services for the medical, security and defence, general industrial, energy and space and commercial aerospace markets worldwide.
