Premier Farnell signs global distribution agreement with EAM for RF and microwave
A global agreement to distribute ConductRF’s range of RF and microwave interconnect products has been signed by Premier Farnell. The agreement with Electronic Assemblies Mfg (EAM), covers the ConductRF brand, used in demanding industries including defence, aerospace, industrial, medical infrastructure, instrumentation and test, and telecommunications.
The company offers interconnect products operating from DC to 110GHz.
The agreement will provide a range of ConductRF solutions for RF and microwave test applications from DC to 70GHz to Premier Farnell’s customers. Among the ConductRF products, Premier Farnell will stock is the TESTeCON series of lab test cables, including low loss TSA74 versions. For VNA testing, the distributor also offers the company’s rugged VNA series products to 40GHz and their Hi-Flex VNA series ranging from 50 to 70GHz.
Dean Gammell, ConductRF, national sales manager said: “Premier Farnell is at the forefront of providing innovative products at a global level for a diverse and growing customer base.”
James McGregor, global head test, tools and production supplies at Premier Farnell added: “Premier Farnell views the expansion of the wireless industrial internet as a major growth opportunity in 2017 and beyond. ConductRF has a first class range of cables and test equipment cable assemblies that are of the highest quality and offer some great accessories to assist engineers working in the RF wireless internet field.”
EAM manufactures and assembles RF products and launched the ConductRF brand of RF and microwave solutions in 2014.
Farnell element14 is part of the Premier Farnell group of businesses, which has operated for over 80 years in high service, technology distribution for electronic system design, production, maintenance and repair. Premier Farnell has a broad customer base, from hobbyists to engineers, maintenance engineers and buyers, as well as working with leading brands and start-ups to support the industry to develop the current and next generation of engineers.
[Photo Credit: AdamR]