Seica offers full probe card test in fixtureless technology
Claimed to be the only flying probe that can offer a turnkey solution for the probe card test, the PilotV8XL HR Next uses fixtureless technology for production and validation testing.
The manufacturing process of silicon wafers simplifies the process and allows many ICs to be placed onto a semiconductor wafer. This wafer is then diced and packaged. Before the dicing is performed, the circuits need to be tested. This electrical test is carried out with the help of a probe card.
A probe card is an interface that provides electrical and mechanical contact between the device under test (DUT), which is the semiconductor wafer, and the test system electronics.
Seica’s PilotV8XL HR Next> series consists of bare board test for single multi-layer organic (MLO) test and PCB test, the ICT and functional test for assembled PCB test and a probe card test for PCN+MLO.
Along with these three test strategies, PilotV8XL HR Next> series ensures integrity connection certification testing (ICCT). This is a requirement for certification for the integrity of the connections between the MLO and PCB.
The Pilot V8 XL HR Next> series is a vertical platform, so it is easy to load and unload all board types including round boards, says Seica. It has eight independent axes and has two standard probes and two high resolution probes at the front and four standard probes at the rear. It uses laser sensors for full warpage control and has a large test are of 800 x 650mm.
With any sensitive product to test it is mandatory to balance the probe contact force in order to not leave witness or scrub marks on the pads or wafers to be probed.
The best approach to not have any visible mark on the die pads are to have a Z movement perpendicular to the MLO. This way, the prober can guarantee the best touch possible without leaving any witness/scrub marks, says Seica.
Any other different angle in the movement of the Z axis will increase the chance of scratches to the die pads.
When the probe card is fully assembled and the MLO is mounted on the PCB interface, the final ICCT test must be performed in order to test the integrity of each single connection between MLO and PCB interface itself.
The PilotV8 XL HR Next> series will generate automatically the specific tests taking into account the resistance of each single path that can be different from one to another.
