STMicroelectronics’ single-chip balun minimises circuitry
A matched balun for STMicroelectronics’ S2-LP 868-927MHz low-power radio transceiver has been introduced to help engineers save board space and minimise RF circuit design in terms of size and cost for competitive products such as IoT sensors, smart meters, alarms, remotes, building automation, and industrial controls.
The 3.26mm2 BALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, explains STMicroelectonics. It replaces a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate, translating to a footprint reduction of more than 96 per cent.
As well as space savings, the circuit design is simplified, as there is no need to select component values or tackle exacting layout challenges, according to STMicroelectronics. Optimised for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximise RF performance.
The BALF-SPI2-01D3 joins STMicroelectronics family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.
The company’s integrated passive device (IPD) on non-conductive glass substrate ensures low RF signal losses, with low amplitude and phase imbalances. This, according to STMicroelectronics results in superior RF-sub-system performance and longer operating life for battery-powered devices.
STMicroelectronics believes that the BALF-SP12-01D3 can help designers can gain a competitive edge in fast-growing markets where connected, smart objects are used to support consumer lifestyles and to enhance business efficiency.
The BALF-SPI2-01D3 is in production now, in a six-bump 2.1 x 1.55mm chip-scale package.
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