TDK upgrades direct-angle sensor to ASIL-B
For functional safety automotive and industrial applications, TDK has upgraded its Micronas 3D HAL direct-angle Hall-effect sensor family. The HAL 37xy – the HAL 37xy, HAR 37xy and HAC 37xy sensors – are now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262.
HAL 37xy rotary position detection features are used in accelerator pedals, electronic throttle controls, rotary shifters (with push-function) and rear-axis steering systems. The sensors detect linear position in applications like clutch or brake pedals, transmission systems, cylinders and valve position sensing.
Samples are available. TDK has enabled vertical Hall plates to integrate into the standard CMOS process through its 3D HAL technology. The process made it easier to evaluate relative strength of the horizontal and vertical magnetic field components, for angular performance. In comparison, conventional planar Hall technology is only sensitive to the magnetic field orthogonal to the chip surface, pointed out TDK.
There are three different direct-angle sensor variants in the HAL 37xy sensors family, the HAL 37xy sensor family, a version with redundancy function via two integrated Hall sensor dies (HAR 37xy), and a version with integrated capacitors (HAC 37xy).
The robust HAL 37xy offers outstanding temperature stability, high resistance against air gap variations and magnet aging, a range of diagnostic functions and very effective protection circuitry. The HAR 37xy dual-die version provides full redundancy from two independent dies stacked in a single package that are bonded on separate sides. The stacked-die architecture ensures that both dies occupy the same magnetic-field position, thus generating synchronous measurement outputs. Redundant sensor solutions in a single package reduce system costs while increasing the reliability of the system through smaller PCBs and less solder joints, said TDK. The third model, the HAC 37xy integrates a chip from the HAL 37xy sensor family and two capacitors up to 330nF in a three-lead TO package for an ESD immunity of up to 8.0kV.
The pins of the package can be welded or soldered directly to a lead frame eliminating the need for a PCB and reducing the total system size and cost, advised TDK.
