Temperature variable attenuator by Smiths Interconnector takes flight
Specifically designed and tested for critical space flight applications, the SpaceNXT K2TVA series is a reliable, passive thermopad from Smiths Interconnect. It is designed to offset signal strength fluctuation due to changes in temperature. It provides unparalleled gain compensation over temperature in K-Band, says the company.
Signal fluctuations affect all RF and microwave systems, explains Smiths. The attenuation shift over-temperature is achieved using thick-film thermistor inks which are screen-printed onto a ceramic substrate of alumina. This patented technology was invented in-house at EMC Technology, one of Smiths Interconnects’ technology brands.
Tullio Panarello, vice president and general manager of fibre optics and components at Smiths Interconnect, said: “The SpaceNXT K2TVA Thermopad series is Smiths Interconnect’s response to the increasing demand for high-reliability connectivity in commercial space programs, particularly GEO/MEO and LEO [geosynchronous equatorial orbit / medium earth orbit and low earth orbit] satellites”. K2TVA is added to the Smiths Interconnect SpaceNXT family, which is for accessible space qualified COTS+ products for next generation space applications”.
Eric Lakin, vice president finance and strategy added that the durable SpaceNXT K2TVA Thermopad attenuators “help customers reach higher frequencies in the face of congestion in broadcast spectrums for wireless communications and when in orbit for communication satellites. They push the boundaries of size, weight and power (SWaP) in a cost effective, easy to implement solution suitable for a wide array of space and defence applications”.
Each SpaceNXT K2TVA Thermopad is engineered using 3D electromagnetic simulation software to support attenuation flatness and voltage standing-wave ratio (VSWR) within the specified frequency band.
The Thermopad can be used in place of a standard chip attenuator to combine level setting or buffering and temperature compensation in a single chip design. This reduces the component count whilst increasing reliability and lowering costs, says Smiths.
The robust, proven thick film process technology on an Alumina substrate provides a product suitable for applications in harsh environments.
The temperature coefficient of attenuation (TCA) is up to four times over the original KTVA series, allowing RF designers even more precise temperature compensation.
Multiple attenuation values, temperature shift options and mounting configurations are available to support both surface mount and wire bond applications.
