Thermal jumper chip removes heat, reduces component count
Heat is removed from electrically isolated components using the ThermaWick surface mount thermal jumper chip that is available from Vishay Intertechnolgy. It is designed to remove heat from electrically isolated components and reduces the temperature of components by over 25 per cent, reports the company.
The ThermaWick THJP series is a Vishay Dale Thin Film device which has been developed to allow designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
It is based on an aluminium nitride substrate with high 170W/m degrees K thermal conductivity. A reduction in the temperature of connected components of over 25 per cent allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved.
The THJP’s capacitance is down to just 0.07pF, making it particularly suitable for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters, RF amplifiers, synthesisers, pin and laser diodes and filters for industrial and telecommunications applications.
The device is available in six case sizes from 0603 to 2512, with custom sizes available on request. The 0612 and 1225 cases have long side terminations for additional heat transference. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.
Thermal resistance ranges from four to 15 degrees per W and thermal conductance is from 65 to 259mW per degree C. Capacitance values range from 0.07 to 0.26pF, depending on the case size (0603, 0612, 0805, 1206, 1225 and 2512).
Samples and production quantities of the ThermaWick THJP series thermal jumper are available now, with lead times of six weeks.
Vishay Intertechnology manufactures discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors), used in electronic devices and equipment in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets.