Thermal management squeezes into thin spaces

With a thickness of 200micron, the Soft-PGS thermal interface material guarantees thermal stability up to 400 degree C with thermal conductivity up to 400W/mK, says Panasonic Automotive & Industrial Systems Europe.

The compressible material reduces contact thermal resistance between rough surfaces in extremely thin spaces and enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation devices (heat sinks).

The 200micro thick graphite sheet designed for use as a thermal interface material for IGBT modules. It can be compressed by 40 per cent, to dramatically reduce thermal resistance between a heat sink and an IGBT module. The Soft-PGS sheet is easy to install, and has far lower labour and installation costs than thermal grease or phase change material, points out the company. It guarantees thermo stability of up to 400 degree C and high reliability against intense heat cycles (-55 to +150 degree C). Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. There is a range of standard sheets for IGBT modules from various suppliers.

Unlike a paste, the material is a homogenous thickness and does not degrade and age over time. Compared to thermal grease and PCM, Soft-PGS fits uneven surfaces better, says the company and offers superior workability, reliability and thermo stability.


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