Thermal putty can be compressed to fill gap
Introducing its latest thermal interface material, the Sarcon PG80A is extremely compressible, says Fujipoly America. The putty-like, gap filler pad exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13 W/m degrees K.
Sarcon PG80A requires very low compression force at high compression rates making it a particularly suitable for applications that have delicate or wide-variation component heights requiring material compression between 30 and 90 per cent.
PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a maximum dimension of 300 x 200mm. Sarcon PG80A can also be ordered in die-cut form to fit almost any application shape, adds Fuijipoly Amercia and can be used at operating temperatures ranging from -40 to +150 degrees C.
Fujipoly® America is a wholly owned subsidiary of Fuji Polymer Industries of Japan. It is an ISO9001:2008 registered company, and specialises in the fabrication of silicone rubber technology. It supplies Zebra elastomeric connectors, Sarcon thermal interface materials, fusible tapes, and custom silicone rubber extrusions.
Fuji Polymer Industries has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives.