Thermally conductive adhesives meet LED heatsink needs
Thermally conductive two-part epoxy adhesives from Intertronics are designed to enhance the effectiveness of heat paths found in applications such as LED heatsink attachment, chip assembly, encapsulation, potting of thermal sensors, assembly of power module, connection of pipes in heat exchangers and the bonding and potting of battery cells and electric motors. They can help optimise production processes, says the company, with a choice of accelerated thermal cures in about 15 minutes or 24 hours at room temperature.
Polytec TC 433 is a semi-rigid boron nitride filled adhesive. It features 2W/mK thermal conductivity and a glass transition around 110°C after thermal curing, withstanding up to 220°C continuous operation temperature.