Thin film sets new standard for compressibility
Claimed to set a new standard for performance and compressibility, the Sarcon 30XR-Um thin film is the latest gap filler pad from Fujipoly.
The putty-like thermal gap filler pad exhibits a thermal conductivity of 17W/m-k and a thermal resistance of only 0.02 degree Cin²/W.
The thermal interface material can be compressed quickly using a very low compression force, says the company. The 0.3mm thin film is available in sheets up to 50 x 50mm and can be cut to custom lengths or die-cut to fit the exact shape of heat-generating components.
The material complies with UL 94 V-0 flame retardancy specifications and is most commonly used to transfer heat from medium to high-power CPUs and semiconductors to nearby heatsinks.