Traveo automotive microcontroller enables dynamic 3D graphics

Cypress Semiconductor has added a new series to its Traveo automotive microcontroller family. The integrated, single-chip devices in the S6J32xEK series include an advanced 3D and 2.5D graphics engine and provide scalability with Cypress’ low-pin-count HyperBus memory interface.

The microcontroller enables dynamic 3D graphics in hybrid instrument clusters and head-up displays.

“Our automotive customers are looking to integrate increasingly more dynamic 3D graphics in their hybrid instrument cluster and head-up displays to appeal to consumers,” said Mathias Braeuer, product marketing director of the Automotive Business Unit at Cypress.

The Traveo S6J32xEK series integrates up to 4Mbyte of high-density embedded flash, 512kbyte RAM and 2Mbyte of video RAM, an Arm Cortex-R5 core at 240MHz performance, a low-voltage differential signalling (LVDS) video output, a low-voltage transistor-transistor logic (LVTTL) video output and a six stepper motor control. This combination enables the microcontrollers to serve as single-chip solutions to drive two displays, confirms Cypress. The devices have up to two 12-pin HyperBus memory interfaces, claimed to dramatically improve read and write performance of graphical data and other data or code. A single HyperBus interface can be used to connect to two memories for firmware over-the-air (FOTA) updates, for end-users to get software fixes and new features and applications for vehicles. The devices support all in-vehicle networking standards required for instrument clusters, including controller area network-flexible data (CAN-FD) and Ethernet AVB. Additionally, the series provides robust security with integrated enhanced secure hardware extension (eSHE) support.

The Traveo S6J32xEK series include 50 channels of 12bit ADCs, 12 channels of multi-function serial interfaces and I2S interfaces with an audio DAC to output the complex, high-quality sounds required in today’s instrument clusters. The devices’ support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time.

The S6J32xEK series offers functional safety features to support Automotive Safety Integrity Level (ASIL) B, and the devices feature a wide ambient temperature range of -40 to +105 degree C.

Cypress supports the Traveo family with a tools and software ecosystem that simplifies system integration, including AutoSar MCAL 4.0.3 support.

The Traveo S6J32xEK series is sampling now and will be in production in Q1 2018. The MCUs are available in a 208-pin and 216-pin thermally enhanced quad flat package (TEQFP).

http://www.cypress.com/automotive

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