Wafer packaged NAND flash storage targets embedded applications
Using 3D NAND flash technologies, combined with ATP’s wafer packaging and testing capabilities, SSDs including M.2, mSata, SlimSata, 2.5inch SSD, eUSB and memory cards provide product differentiation for industrial and embedded markets.
3D NAND technology has become the flash storage technology of choice, argues the company, and will propagate to the embedded markets such as industrial, IoT, medical, automotive and telecomms.
In addition, by taking 3D NAND wafers to package its own BGAs and TSOPs and testing to specifications, the company provides a multitude of various chip densities using DDP, QDP and even ODP die-stacking while using the same wafer stock. This provides not only the flexibility in supply chain, but also enables it to ramp multiple product densities quickly.
Visit ATP at the Flash Memory Summit 2016 (August 9 to 11) Santa Clara Convention Center, meeting room #205.
