3D solder paste inspection system maximises efficiency
The TR7007Q SII is a 3D SPI (solder paste inspection) system by TRI (Test Research Inc), designed to maximise production efficiency. The high speed system delivers up to 50 per cent faster inspection compared to previous models, confirmed the company.
The TR7007Q SII is equipped with a 9.8 micron high resolution 21Mpixel camera for enhanced measurement accuracy and stability. It is suitable for a range of industries, said TRI, and can inspect bumps, flux, mini LED solder and bare boards as well as solder paste.
The company claimed that its stability enables precise solder measurements and minimises false calls for reliable inspection results. It is equipped with a wide spectrum light system and coaxial lighting for high contrast, clarity and uniformity to improve detection rates.
The Smart 3D SPI solutions are claimed to ease data exchange between the production line and the manufacturing system of choice to enable data traceability for the connected factory. TRI’s SPI platforms facilitate data exchange for closed-loop and support the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Test Research, Inc. (TRI) offers a portfolio for automatic test and inspection products to meet a comprehensive range of manufacturing test and inspection requirements.
