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Level translators support legacy and future mobile phone SIM cards

Tue, 28 June
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Power amplifier does not need DFD, CFR or ET, says Guerilla RF

Tue, 28 June
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Allegro integrates TMR and vertical Hall elements in position sensors for ADAS 

Tue, 28 June
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Capacitors and SiC stack combine in high power density SiC inverters

Mon, 27 June
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Hall switches replace reed switches for level sensing

Mon, 27 June
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Renesas delivers intelligent sensor solutions for IoT applications

Fri, 24 June
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Rohm introduces small ICs for camera modules

Fri, 24 June
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Synthesiser enables performance in GSPS data converter solutions 

Fri, 24 June
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Power amplifiers provide 23dBm of natively linear output power for 5G

Fri, 24 June
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Eight-bit MCU development board connects to 5G LTE-M NB-IoT networks

Thu, 23 June
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Control software targets for three-phase BLDC motor drives 

Thu, 23 June
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Diodes unveils devices to support PCIe 5.0 computing

Thu, 23 June
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Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity

Wed, 22 June
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Two automotive processors from NXP deliver GHz speeds

Wed, 22 June
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Bluetooth LE wireless MCUs make connectivity more affordable 

Wed, 22 June
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Integrated listener for NFC wireless charging cuts board footprint by more than half

Wed, 22 June
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TouchNetix releases integrated force sensing technology

Tue, 21 June
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Infineon introduces Motix motor controller and three-phase gate driver

Tue, 21 June
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Infineon adds the AIROC CYW20820 system on chip for flexibility, low power and high-performance connectivity

Mon, 20 June
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STMicroelectronics’ new inertial modules enable AI training inside the sensor

Mon, 20 June
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