Newsletters

March 19th 2018: The latest electronics news straight to your inbox register here

Today, Xilinx introduces a new category of multi-core technology – the ACAP which they claim goes far beyond the capabilities of an FPGA.
Also today partnerships, with Cypress Semiconductor’s SoC providing wireless connectivity for the Raspberry Pi 3 Model B+ IoT SBC and congatec supplying a SMARC CoM for the Luxoft automotive reference platform.
Two n-channel MOSFET driver ICs from Toshiba target rapid charging applications and finally, Silicon Labs’ clock buffers combine PCIe Gen 4 and low power design.

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March 15th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, expanding the Raspberry Pi offering, Farnell element14 offers the upgraded model and an exclusive starter pack and EM Microelectronic claims its RAINFC enables NFC consumer interaction with the world’s first EPC Gen2v2 certification.

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March 13th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, ON Semiconductor announces its image sensors are qualified to AEC-Q100, while Renesas Electronics releases 25Gbit per second directly modulated laser diodes for 5G basestations.
Also today, chip scale LED packages from Samsung are claimed to offer the highest luminous efficacies and Keysight Technologies offers a wide band millimeter-wave technology to verify automotive radar systems.

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March 8th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter we update you with news from Analog Devices and Microsemi’s collaboration to reduce time to market, ON Semiconductor’s LED controller options and Power Integrations’ update to its InnoSwitch family.

DC/DC converters for renewable energy from CUI while Silicon Labs drives IoT growth with two PoE ICs. Finally, board technology advances with Abaco Systems’ 3U VPS FMC+ FPGA carrier for mil/aero applications.

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March 6th 2018: The latest electronics news straight to your inbox register here

The IRPS5401 is an integrated power management IC ideal for tight board space requirements; for example, FPGAs, System On Chip ASICs and multi-core processors containing several voltages that require precision accuracy and voltage sequencing. With its scalable power options, the IRPS5401 provides power design flexibility and addresses different types of ASICs and FPGAs.

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March 2nd 2018: The latest electronics news straight to your inbox register here

Today, news from Apec in Texas, USA, as Coilcraft introduces high voltage coupled inductors. In other power-related releases, Rohm extends battery life with its latest DC/DC converter, and Texas Instruments expands its GaN portfolio. Varjo and Socionext redefine display resolution in virtual reality displays.

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February 26th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, Cypress, SparkFun and Digi-Key have joined forces to offer an Internet of Things development platform that helps engineers prototype sensor-to-cloud solutions quickly and easily. Meanwhile, an extended STM32 ecosystem with Sigfox package from STMelectronics allows extra flexibility to connect IoT devices to long-range, low-power wireless networks. 

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February 22nd 2018: The latest electronics news straight to your inbox register here

Interesting projects to help engineers figure in today’s newsletter, with an NB-IoT Arduino shield for WAN connectivity from Avnet Silica and an evaluation board from Recom to extend the SensiBLE module’s longevity. Texas Instruments looks ahead to smart cars, buildings, factories and cities while Advantech and MEN Elektronik introduce boards for computing and graphics demands. Finally from Switzerland, Micro Crystal announces a low power real time clock module.

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February 20th 2018: The latest electronics news straight to your inbox register here

Today, Renesas Electronics adds three development boards for its MCU families and STMicroelectronics helps developers link to the cloud. Also today, Intel adds to its SSD offering to meet data centre needs while MIPS and NetSpeed partner to create AI SoCs and AVX claims to offer the first space level X7R BME MLCCs. Finally, Framos shakes up lenses for robotic and industrial applications. Plus lots more news from around the Globe.

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February 13th 2018: The latest electronics news straight to your inbox register here

In today’s news, IoT developments as Lemonbeat introduces Studio 2.0 and Advantech announces an all-in-one signage module based on Intel’s 8th Gen Core processor.
A circuit from Diodes monitors systems voltage with a programmable delay and Infineon integrates shunts into its IGBTs to lower system costs.
Finally, Framos offers the CMOS sensor from ON Semiconductor that mixes 2D and 3D.

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February 9th 2018: The latest electronics news straight to your inbox register here

It’s a first for the space industry as Renesas Electronics launches the 100V and 200V GaN FET power supply solutions, while power supply applications in industrial equipment and motor control applications look set to benefit from Toshiba’s 100V N-channel power MOSFETS. High efficiency and very low standby power make Power Integrations’ new drivers particularly suitable for smart lighting and ballast applications while NI has made significant improvements to the PXI SMU channel density for the Semiconductor Test System. Finally, tiny but mighty is the tag for Texas Instruments’ new operational amplifier and comparators which reduce overall footprint in IoT, personal electronics and industrial applications.

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February 6th 2018: The latest electronics news straight to your inbox register here

Today, FPGAs are highlighted as VadaTech introduces an AMC card with Xilinx’s UltraScale+ FPGA and Toshiba bases its Bluetooth 4.2 evaluation and prototyping development platform on its Bluetooth LE controller. Also in today’s newsletter, companies are looking ahead, as evidenced by the introduction of software packages for IEEE802.11ax devices by Anritsu.  Analog Devices announce a regulator to power FPGAs, GPUs and ASICs and finally, we have plasma systems for 3D and wafer-level package assembly from Nordson March.

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February 1st 2018: The latest electronics news straight to your inbox register here

Today we bring you news from DesignCon, where Keysight Technologies integrates design and test software to accelerate development. In other news, Diodes releases constant current LED drivers in a low profile DFN package, Littelfuse offers TVSdiode arrays for telecomms ports, and Omron clicks with slim device manufacturers with a thin, tactile switch. Finally, an announcement at this month’s ISSCC by Samsung for a SSD that allows sufficient storage for AI and HPC.

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January 30th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, Texas Instruments announces additions for power control in its C2000 Piccolo MCU range and BRIDG collaborates with Face International to develop battery-free IoT wireless sensors. Renesas Electronics adds 38 MCUs for touch-based applications while Fujitsu Electronics Europe expands its Bluetooth Low Energy offering. Finally, the first evaluation board introduced by Recom is for the R-78S and IoT applications.

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January 25th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, Analog Devices introduces a supercapacitor back-up power controller and Belden looks to support PoE and TSN with its latest network management software. Toshiba launches small LDO regulator ICs suitable for IoT applications while TDK adds noise suppression filters for LED lighting systems. Finally, Gowanda introduces mil-RF surface mount inductors.

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January 23rd 2018: The latest electronics news straight to your inbox register here

Today, the IoT is even more accessible with u-blox’s LTE Cat M1 and NB-IoT multimode module also a preview from Nordic Semiconductor for the nRF91 SiP to increase IoT connectivity. Samsung Electronics aims to advance graphics with its 16Gbit GDDR6 while Vishay introduces a diode that can replace mercury UVC lamps. Toshiba Electronics Europe seeks to protect portable devices with the release of a bi-directional ESD and finally, Win a Microchip ATmega328PB Development Suite Bundle with Microchip and Softei.com

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January 18th 2018:  The latest electronics news straight to your inbox register here

In today’s newsletter, Cypress Semiconductor boasts it has the most advanced automotive touchscreen controller, while Analog Devices introduces a low power active mixer. Samtec expands its Edge Card connector range and Fischer Elektronik introduces a thermal conductive material as an alternative for pastes. Panasonic introduces an integrated Wi-Fi module, plus lots more from around the industry.

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January 15th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, Samsung has begun mass production of its second-generation HBM-2 memory, boasting the industry’s highest data transmission rates, Keysight introduces the third generation of parametric test system, and Fujitsu introduces a new die shrink FRAM generation. Digi-Key makes Sigfox’s SDR dongle developers’ platform available worldwide and finally, TE Connectivity claims to have developed the world’s smallest PCB relay.

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January 11th 2018: The latest electronics news straight to your inbox register here

In today’s newsletter, more news from CES, as NuCurrent introduces a Qi-charging 15W antenna for smartphones and Antenova’s latest antenna boosts GNSS signals. Also from CES we bring you 5G news from the Skyworks launch and an emotion detection headset from imec and Holst Centre. Finally, Analog Devices can save space with its latest hybrid DC/DC controller.

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January 9th 2018: The latest electronics news straight to your inbox register here

There is plenty of news from CES 2018 today, as Bosch Sensortec launches a low power accelerometer for wearables and IoT applications while Intel showcases its 8th Gen Intel Core processors with Radeon RX Vega M graphics for gamers and content creators.  Also at CES news from Infineon, with 3D facial recognition sensors. In today’s newsletter there is also IP from X-Fab and its NVM for harsh environments and finally, Maxim Integrated prepares for safer, smarter cars with an advanced battery management system.

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January 5th 2018: The latest electronics news straight to your inbox register here

Ahead of CES18, we bring news of Avnet’s IoTConnect software platform and connectivity portfolio. Samsung adds deep learning to enhance the multimedia experience with its latest applications processor and Rohde & Schwarz’s eCall test is certified to help vehicle manufacturers ahead of the April deadline.  Also today there is a new thermal conductive material from Fischer Elektronik, and a low power clock oscillator from IQD. Finally, news that cars which speed up drivers’ reaction times and anticipate acceleration, steering and braking by reading brainwaves could be available within five to ten years.

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January 1st 2018: The latest electronics news straight to your inbox register here

Welcome to the first newsletter of 2018 and ahead of CES, we bring you news of Powercast’s wireless transmitter. TE Connectivity adds PCB headers to its Power Triple Lock connector family and Panasonic unveils a Bluetooth 4.2 modules. Alps Electric has developed Tact switches for quiet, automotive interiors and Axiomtek announces a medical-grade touch panel PC. Finally, we would like to wish all of our readers a happy and prosperous New Year.

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