600V-rated intelligent power devices save space in BLDC motor drives
Able to contribute to miniaturisation in space-critical applications, the TPD4163F and the TPD4164F are intelligent power devices for brushless DC (BLDC) motor drive applications including fan motors, ventilation fan, air conditioners, air cleaners and pumps.
Each incorporates 600V-rated IGBTs and a matched gate driver as a single-chip solution in a single, compact package. The output DC current (IOUT) rating of the TPD4163F is 1A and the TPD4164F is rated at 2A.
They have an IGBT saturation voltage (VCEsat) of 2.6V (TPD4163F) and 3.0V for the TPD4164F. The diode forward voltage (VF) is 2.0V and 2.5V.
Both devices are housed in a miniature surface mount HSSOP31 package, with dimensions of just 17.5 x 11.93 x 2.2mm. The PCB footprint is reduced by around 63 per cent when compared with Toshiba’s existing DIP26 package products for a “significant contribution” to reducing the space required for motor drive circuit boards.
In addition, in geographic regions where the power supply is unstable, the supply voltage may fluctuate significantly, advised Toshiba. To improve reliability, the supply voltage rating (VBB) has been increased from 500V to 600V to introduce more design margin.
A reference design for BLDC sensorless brushless DC motor drives, using the TPD4164F and a microcontroller TMPM374FWUG is available.
Volume production shipments of both new devices (and the reference design board) are available now.
Toshiba Electronics Europe (TEE) offers European consumers and businesses a variety of hard disk drive (HDD) products and semiconductors for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods applications. The portfolio also encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs).
In addition, TEE also offers Toshiba’s SCiB battery cells and modules with lithium titanium oxide (LTO) for heavy-duty applications and Silicon Nitride (SiN) ceramic substrates used in power semiconductor modules, inverters and converters for their heat dissipation characteristics and strength.
TEE’s headquarters are in Düsseldorf, Germany, and branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services.
