MOSFET increases conversion efficiency and saves space, says Diodes Incorporated
To increase efficiency in a smaller package, the DMN3012LEG is the first in wat Diodes describes as a new generation of discrete MOSFETs. The DMN3012LEG integrates dual MOSFETs in a single package measuring just 3.3 x 3.3mm and reduces the board space requirement by up to 50 per cent compared to a typical two-chip solution, said the company.
This level of space saving benefits a range of applications using point of load (PoL) and power management modules. The DMN3012LEG can be used in DC/DC synchronous buck converters and half-bridge power topologies to reduce the size of power converters.
The 3D structure of the PowerDI 3333-8 Type D package is also claimed to increase overall power efficiency, while the high voltage and current ratings make it widely applicable, said Diodes. The fully-grounded pad design delivers good thermal performance, for cooler running. The high switching speeds and efficiency of the process used also minimises the need for large inductors and capacitors.
The DMN3012LEG integrates two N-channel enhancement mode MOSFETs, making it well suited for synchronous buck converter designs. Using a lateral diffused MOS (LDMOS) process, it combines fast turn-on and turn-off delay speeds of 5.1 nanoseconds and 6.4 nanoseconds for Q1, and 4.4 and 12.4 nanoseconds for Q2. The device has maximum on-resistance (RDS(ON)) figures of just 12 mOhm at Vgs of 5.0V for Q1 and 6 mOhm at Vgs of 5.0V for Q2. The DMN3012LEG can accept a 30V drain-source voltage with 10V gate-source, while supporting 5.0V gate drive.
The DMN3012LEG is available now.
Diodes supplies semiconductor products to companies around the world operating in the consumer electronics, computing, communications, industrial, and automotive markets. Its product portfolio is made up of discrete, analogue and mixed-signal products and packaging technology. The company has worldwide operations of 28 sites, including engineering, testing, manufacturing, and customer service.
